51st European Solid-State Device Research Conference

47th European Solid-State Circuits Conference




  • Economic, social and cultural development
  • Development of the metropolitan area
  • Local housing program
  • Social cohesion and urban policy
  • Public services management
  • Environment



At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com


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竖版华为公司标志 Vertical Version of Huawei Corp

Huawei (www.huawei.com), founded in 1987 and 100% owned by its employees, is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have more than 194,000 employees, and we operate in more than 170 countries and regions, serving more than three billion people around the world.

Our vision and mission is to bring digital to every person, home and organization for a fully connected, intelligent world. To this end, we will drive ubiquitous connectivity and promote equal access to networks; bring cloud and artificial intelligence to all four corners of the earth to provide superior computing power where you need it, when you need it; build digital platforms to help all industries and organizations become more agile, efficient, and dynamic; redefine user experience with AI, making it more personalized for people in all aspects of their life, whether they are at home, in the office, or on the go.


Founded in 2004, Huawei’s fully-owned Group company HiSilicon (www.hisilicon.com/en) is an industry-leading, currently mostly fabless, semiconductor business. HiSilicon provides leading chipset solutions and services for devices used in smart homes, smart cities, smart mobility, and a variety of other scenarios. Our portfolio covers a wide range of fields, including smart vision, smart IoT, smart media, smart transportation, automotive electronics, displays, mobile SoC, data centers, and optical transceivers.

HiSilicon has more than 7,000 employees across 12 offices and R&D centers located in China (Shenzhen, Beijing, Shanghai, Chengdu, Wuhan), Singapore, South Korea, Japan, and Europe. Many years of industry development experience has allowed us to master top-tier IC design and verification technologies, while also optimizing our EDA design platforms, development processes, and specifications. Throughout this time, we have successfully developed more than 200 types of chipsets with related intellectual property rights (IPRs), and applied for more than 8,000 patents.

HiSilicon is committed to enabling smart devices across all scenarios, providing global customers with quality chipsets and solutions, while focusing on excellent service and quick responses. As we forge ahead, we will continue to create value for our customers.


Innovation in semiconductor devices, circuits, chipsets and applications is and will remain a major research & development focus of Huawei, which (as a Group i.e. across numerous fields of high-tech, many of which enabled by semiconductor-based technologies, components and systems) spent EUR 18 bn (15.9% of revenues) on R&D in 2020, with an R&D headcount of ~105,000 (53.4% of total workforce). We aim to remain an employer of choice for the best researchers and engineers working at the cutting edge of technology globally, and a preferred partner to the world’s most innovative and successful (academic and business) organizations for pushing the limits of science & engineering and developing distinctive, practical solutions to a wide range of business and societal challenges.



We design and deliver innovative substrates and solutions to enable our customers' products shaping everyday life.



X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs) as a foundry on behalf of customers.

Processing signals from the real analogue world, such as light, temperature or speed, for further digital processing or converting digital signals into analogue is the task of mixed-signal chips. With the development of powerful semiconductor processes for the production of integrated circuits, a comprehensive range of services and first-class technical support, X-FAB has become one of the world's leading companies in the semiconductor market.


GLOBALFOUNDRIES (GF) is a leading specialty foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.  


GLOBALFOUNDRIES Dresden (GFD) in Germany is one of the most productive and advanced wafer fabs in the world and serves GLOBALFOUNDRIES’ customers around the globe with innovative semiconductor products in 22nm, 28nm, 40nm and 55nm technologies on 300mm wafers. With about 3,200 highly skilled professionals and a total clean room floor space of more than 50.000 m2, GF Fab 1 is Europe’s leading foundry. The range of services is complemented by the adjacent  Advanced Mask Technology Center (AMTC), a joint venture between Toppan Photomasks, Inc. and GF, as well as a Bump-Test-Facility directly at the GF Dresden site. To date, more than US$ 12 billion have been invested in the Dresden operations. 


ICsense -an independent subsidiary of the TDK group- is Europe’s premier IC design company. ICsense’s core business is ASIC development and supply and custom IC design services. ICsense has the largest fab-independent European design group with world-class expertise in analog, digital, mixed-signal and high-voltage IC design. The company develops and supplies customer exclusive ASIC solutions for the automotive, medical, industrial and consumer market compliant with ISO9001, ISO13485, IEC61508-ISO26262.



Nov 16-19, 2021 | MESSE MÜNCHEN | Co-located with Productronica
The Largest European Microelctronics Platform connecting Industry Leaders across the entire Design and Manufacturing Supply Chain
SEMI is thrilled to present a new event that brings together the global microelectronics supply chain, manufacturers, and end users for a digital experience featuring industry thought leaders and high value technical content.




The ESSCIRC/ESSDERC joint conference is the most important and successful conference on microelectronics technology and circuits in Europe, annually organized for already more than four decades.


It aims to provide a forum for the presentation and discussion of recent advances in this field. The keynote and invited speakers from academia and industry, the tutorials and workshop, as well as the quality of the presentations and the networking opportunities are making this conference a key event attended by researcher s and industrialists from all over the world.


As a sponsor you company/organization will benefit from the high visibility offered by this success and gain access to world’s  leading R&D institutions and industries.


Available sponsoring packages are: 


  • DIAMOND Sponsor Package

  • PLATINUM Sponsor Package

  • GOLD Sponsor Package

  • SILVER  Sponsor Package

All sponsoring packages can be customized to suit your company/organization preference. In all cases the sponsoring company/organization will be clearly identified.


Please contact the ORGANIZING SECRETARIAT for further information.

 51st European Solid-State Device Research Conference

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 47th European Solid-State Circuits Conference

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