2. Devices and circuits enabling the path towards 6G
Chairs: Stefan Andersson (Ericsson) and Nadine Collaert (imec)

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2.1) 5G evolution and 6G: benefits and challenges

Takehiro Nakamura (NTT Docomo, Japan)

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2.2) Millimeter-wave/THz Phased-Array Transceiver for Beyond 5G

Kenichi Okada (Tokyo Institute of Technology, Japan)

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2.3) Millimeter Wave and Sub-THz Power Amplifiers ― Enabling Technologies for Beyond-5G and 6G Wireless Networks

Hua Wang (ETH Zurich, Switzerland)

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2.4) DSP-assisted RF-sampling data converters for 5G soft radio and beyond

Martin Clara (Intel, USA)

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2.5) Packaging requirements for mmW & THz wireless applications

Ivan Ndip (Fraunhofer IZM, Germany)

 

2.6) THz circuits and applications

Patrick Reynaert (KU Leuven, imec, Belgium)

 

2.7) InP technologies for mmW & THz wireless applications

Miguel Urteaga (Teledyne, USA)

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2.8) SiGe HBT devices/circuits for mmW & THz wireless applications

Ullrich Pfeiffer (University of Wuppertal, Germany)